Cooling of Power Switching Semiconductor

Semiconductor power losses are dissipated in the form of heat, which must be transferred away from the switching junction, if efficient switching is to be maintained. The reliability and life expectancy of any power semiconductor are directly related to the maximum device junction temperature experienced. It is therefore essential that the thermal design determine accurately the maximum junction temperature from the device power dissipation. Every 10°C junction temperature decrease, doubles device lifetime.

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Basic Semiconductor Physics

Power electronic circuits utilise power  semiconductor switching devices which  ideally  present infinite resistance when off, zero resistance when on, and switch instantaneously between those two states.  It is necessary for the power electronics engineer to have a general appreciation of the semiconductor physics aspects applicable to power switching devices so as to be able to understand the vocabulary and the non-ideal device electrical phenomena.  To this end, it is only necessary to attempt a qualitative description of switching devices and the relation between their geometry, material parameters, and physical operating mechanisms.

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